Thoroughly cleaning SMT (surface mount technology) stencils, tools and equipment is an important way to reduce misprints and increase throughput. Techspray SMT stencil cleaners are designed for rigorous production requirements.
Techspray offers a wide variety of stencil cleaners that are effective on solder paste and adhesives. Under the Techspray Renew brand, eco-friendly water-based formulas are available for hand wipes, understencil cleaning and batch cleaning. For low cost, effective cleaning, a full line of isopropyl alcohol (IPA) is available.
Three Industrial PCB Cleaning Methods to Use After Surface Mount Soldering:
Manual PCB Cleaning Method: Manual cleaning is still an effective way of cleaning PCBAs. Following the stages listed above, isopropyl alcohol is a common cleaning agent for this method.
Batch or Inline PCB Cleaning with Water: In order to reduce the time required to clean boards, a batch quantity of boards is often processed. An automated in-line process can increase efficiency. Both of these techniques may be performed using water or a chemical cleaning agent to remove no-clean flux residue.
Gas Phase PCB Cleaning Method: Gas or steam is also used to clean circuit boards. This method, also known as vapor phase cleaning, requires boiling a chemical solvent to produce steam which in turn separates contaminants from the board.
Manual & Under Stencil Cleaner - Effectively removes all types of solder paste (e.g. waterbased, RMA, noclean, leadfree) and uncured adhesive from screens, misprinted boards and equipment. Compatible with Batch ultrasonic cleaning systems
Cleans reflow ovens, wave soldering systems, and associated heat exchanger systems by removing all types of flux residues - Quickly clean flux residue from oven & wave fingers
Techspray offers alternatives to IPA that are as effective if not more so, and in many cases nonflammable with lower environmental impact.
Techspray offers IPA alternatives for:
Electronic printed circuit board (PCB) assembly
Removal of solder paste or adhesive from SMT stencils
Maintenance cl...
This is a multi-part series covering the best practices of establishing a new cleaning process. These are written by Pierce Pillon, Techspray’s Field Engineer. Contact us if you want Pierce’s help developing or improving your own cleaning process.
Occasionally, you will need to assess...
Chemicals are found throughout the electronic assembly and repair process, but no solvent is more common than isopropyl alcohol. It is universally used for cleaning and as a main constituent of fluxes, but how much do you really know about isopropyl alcohol?
Isopropyl alcohol (CAS #67-63-0) is also...
What is soldering?
Soldering is the joining of two metal surfaces mechanically and electrically, with the use of metal called solder (pronounced “sodder”). Solder secures the connection so it doesn’t break loose from vibration, other mechanical forces and provides electrical conti...